高通取得與蘋果全球專利授權協議展延

（更正標題，說明這是「專利授權」協議，而非「晶片授權」；此錯誤也出現在先前版本的報導中）(Corrects headline to say "patent licensing" agreement, not "chip licensing;" The error also appeared in a previous version of the story)

9月24日（路透）——高通（Qualcomm）週四表示，蘋果（Apple）已延長與這家晶片設計公司的專利授權協議，儘管這家iPhone製造商正尋求降低對高通數據機晶片的依賴。Sept 24 (Reuters) - Qualcomm said on Thursday Apple has extended its patent-licensing agreement with the chip designer, even as the iPhone maker looks to cut its reliance on the company's modem chips.

這家半導體公司未說明這項最新舉措的時程。目前的協議將於2027年3月31日到期，並可選擇延長兩年。蘋果與高通均未回應媒體詢問。The semiconductor company did not give a timeline for the latest move. The current agreement ends on March 31, 2027, with an option to extend it by two years. Both Apple and Qualcomm did not respond to requests for comment.

即使這項協議使蘋果仍與高通部分專利組合維持關係，高通7月曾表示，來自蘋果產品的營收將比預期更快下滑。Even though the deal keeps Apple tied to some of Qualcomm's patent portfolio, the chip designer had said in July that revenue from Apple products would decline faster than expected.

高通的授權業務在6月當季約占總營收15%。該公司曾表示，將寄望資料中心業務成長，以抵銷2027年來自蘋果的營收損失。Qualcomm's licensing business accounted for roughly 15% of total revenue in the June quarter. The company had said it was banking on growth in its data center business to offset the lost revenue from Apple in 2027.

2023年，高通與蘋果簽署協議，將至少供應5G晶片至2026年；當時這家iPhone製造商在中國面臨加劇的挑戰，並希望在其他地方強化供應鏈。In 2023, Qualcomm signed a deal with Apple to supply 5G chips until at least 2026, at a time when the iPhone maker was facing increased challenges in China and looked to shore up its supply chains elsewhere.

這項合作關係受到2019年和解協議形塑；該和解結束了雙方就無線專利權利金與數據機晶片供應展開、歷時兩年的全球法律戰。兩家公司於2019年4月宣布休戰，當時雙方在聖地牙哥的美國陪審團審判正要展開。The partnership has been shaped by a 2019 settlement that ended a two-year global legal battle over wireless-patent royalties and modem-chip supply. They announced the truce in April 2019 as a U.S. jury trial between them was beginning in San Diego.

根據和解內容，蘋果向高通支付一筆未公開金額，兩家公司撤回全球各地訴訟，並同意自2019年4月1日起簽訂為期六年的全球專利授權協議。Under the settlement, Apple made an undisclosed payment to Qualcomm, the companies dropped litigation worldwide and agreed to a six-year global patent licensing deal from April 1, 2019.

（班加羅爾Akash Sriram報導；Arun Koyyur編輯）(Reporting by Akash Sriram in Bengaluru; Editing by Arun Koyyur)